Electronics Forum | Thu Mar 13 01:42:58 EDT 2008 | Sean
Thanks Real Chunks and Davef...Yours input is valuable to me. My inputs towards your question asked below: Questions are: * Why did you tell us the following? "This BGA is installed with heatsink (with hook at both side of the heat sink) manually b
Electronics Forum | Thu Nov 04 19:51:28 EST 1999 | John
Thanks folks. The current vendor is doing an alcohol wash, top and bottom, then performing an ionic test on 100 boards. I'm not to confident in the testing because the readings for a "clean" board are 25 ugm/sq in and a "dirty" board are 40 ugm/sq in
Electronics Forum | Thu Mar 06 03:46:35 EST 2003 | testing
Thanks for the reply Mike, I will look forward to see the end result of your investigation (e-mail people_1@fsmail.net). Regarding the test machines, I was trying to ask what are the suited/or recommended from your experience, set of test equipment
Electronics Forum | Sat Jun 03 03:35:16 EDT 2006 | mika
Yes we do have a problem with this. We have by now investigate numerous lead/RoHS PCBA:s The RoHS boards are by far the most difficult one's to probe and test. Our people at the "test area" including Flying Probe and ICT they spend a lot of time to t
Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN
We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer
Electronics Forum | Wed Dec 20 04:43:36 EST 2006 | greg york
Any decent flux would volatise off with the heat of the wave unless absorbed into the solder mask. Test this by trying to clean in alcohol or common solvent aerosol, if it does not clean then it is probably Mineral Salts from solder mask fillers. Ano
Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist
I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i
Electronics Forum | Wed Mar 20 07:57:30 EST 2002 | davef
Purchase: 7095 - Design and Assembly Process Implementation for BGA's Make every effort to distribute the test pads, because if you keep them massed at the ball, it would be a bijundo kick in the BGA rear section, when all of those pins released.
Electronics Forum | Mon May 23 11:37:36 EDT 2005 | dougt
AND A B C -------- 0 0 0 1 0 0 0 1 0 1 1 1 C is the result Are you studying for a test?
Electronics Forum | Sat Mar 15 01:03:10 EDT 2008 | callckq
All, What if BGA solder crack do exist after the shock test? Its happen at the corner of the BGA. Base on your experience, what are the potential root causes? Thanks, Sean
